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【英文标准名称】:Mechanicalstandardizationofsemiconductordevices.Generalrulesforthepreparationofoutlinedrawingsofsurfacemountedsemiconductordevicepackages.Designguidelinesforfine-pitchlandgridarray(FLGA)
【原文标准名称】:半导体装置的机械标准化.表面安装半导体装置封装外形图制备的通用规范.细微间距栅级阵列(FLGA)的设计指南
【标准号】:BSEN60191-6-12-2011
【标准状态】:现行
【国别】:英国
【发布日期】:2011-08-31
【实施或试行日期】:2011-08-31
【发布单位】:英国标准学会(GB-BSI)
【起草单位】:BSI
【标准类型】:()
【标准水平】:()
【中文主题词】:
【英文主题词】:Casedrawing;Components;Connectingdimensions;Connections;Definitions;Design;Dimensions;Drawings;Electricenclosures;Electricalengineering;Electronicengineering;Electronicequipmentandcomponents;Enclosures;Engineeringdrawings;Erecting(constructionoperation);Gridsystems;Guidebooks;Guidelines;Illustrations;Integratedcircuits;LandGridArray;Marking;Matrices;Mechanic;Packages;Rectangularshape;Semiconductordevices;Semiconductorpackage;Semiconductors;SMD;Surfacemounting;Surfacemountingdevices;Symbols;Types
【摘要】:ThispartofIEC60191providesstandardoutlinedrawings,dimensions,andrecommendedvariationsforallfine-pitchlandgridarraypackages(FLGA)withterminalpitchof0,8mmorless.
【中国标准分类号】:L40
【国际标准分类号】:31_080_01
【页数】:24P.;A4
【正文语种】:英语